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InferenceX v2: NVIDIA Blackwell Vs AMD vs Hopper - Formerly InferenceMAX
The Artist Known as InferenceMAX. GB300 NVL72, MI355X, B200, H100, Disaggregated Serving, Wide Expert Parallelism, Large Mixture of Experts, SGLang…
 • Dylan Patel, Cam Quilici, Bryan Shan, Alec Ibarra, Kimbo Chen, Daniel Nishball, and Cheang Kang Wen
CPUs are Back: The Datacenter CPU Landscape in 2026
RL and Agent Usage, Context Memory Storage, DRAM Pricing Impacts, CPU Interconnect Evolution, AMD Venice, Verano, Florence, Intel Diamond Rapids, Coral…
 • Gerald Wong and Dylan Patel
Memory Mania: How a Once-in-Four-Decades Shortage Is Fueling a Memory Boom
Pricing doubles again, Supercycle is bigger, and could last longer than you think
 • Dylan Patel, Ray Wang, Myron Xie, Doug, and Jeff Koch
Claude Code is the Inflection Point
What It Is, How We Use It, Industry Repercussions, Microsoft's Dilemma, Why Anthropic Is Winning
 • Doug O'Laughlin, Jeremie Eliahou Ontiveros, Jordan Nanos, Dylan Patel, and Daniel Nishball

January 2026

From Tokens to Burgers: A Water Footprint Face-Off
A different perspective on the datacenter water debate, forget tokens/watt or tokens/dollar, it's about tokens/burger, how many In-N-Outs is equivalent…
 • Nicolas Bontigui and Dylan Patel
Interconnects Beyond Copper, 1,000 CFETs, SK Hynix Next-Gen NAND, 2D Materials, and More
IEDM 2025 Round-Up
 • Gerald Wong, Jeff Koch, Randy Chiang, DC, and Dylan Patel
Apple-TSMC: The Partnership That Built Modern Semiconductors
Wafer demand model, node economics, and the shifting power dynamics as AI reshapes the foundry landscape
 • Sravan Kundojjala, Gerald Wong, Dylan Patel, and Jeff Koch
RL Environments and RL for Science: Data Foundries and Multi-Agent Architectures
Worker Automation, RL as a Service, Anthropic's next big bet, GDPval and Utility Evals, Computer Use Agents, LLMs in Biology, Mid-Training, Lab…
 • AJ Kourabi and Dylan Patel
Co-Packaged Optics (CPO) Book – Scaling with Light for the Next Wave of Interconnect
Co-Packaged Optics (CPO) has long promised to transform datacenter connectivity, but it has taken a long time for the technology to come to market, with…
 • Dylan Patel, Daniel Nishball, Myron Xie, Ivan Chiam, Clara Ee, and Patrick Zhou

December 2025

How AI Labs Are Solving the Power Crisis: The Onsite Gas Deep Dive
Bring Your Own Generation, Sayonara Electric Grid, Turbines vs. Recips. vs. Fuel Cells, Why Not Build More CCGTs?, Onsite Power TCO
 • Ajey Pandey, Jeremie Eliahou Ontiveros, and Dylan Patel
AWS Trainium3 Deep Dive | A Potential Challenger Approaching
NL72x2/NL32x2 Scale Up Rack Architecture, Step-Function Software & System Improvements, Optimized Perf per TCO, “Amazon Basics” GB200 NVL36x2, Astera…
 • Dylan Patel, Daniel Nishball, Wega Chu, Myron Xie, Ivan Chiam, Clara Ee, Cheang Kang Wen, Wei Zhou, Jeremie Eliahou Ontiveros, and Tanj Bennett
TSMC Overseas Fabs – A Success?
Why Morris Chang Said U.S. Fabs Will Fail, Wafer Cost and Economics of Taiwan vs. U.S. Fabs, TSMC Supply Chain Details
 • Dylan Patel, Steven Lee, and Jeff Koch
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